“Love Innovation, Endless Intelligence”: CEIC 2026 Set to Unveil as the Consumer Electronics Innovation Conference 2026 Press Conference Takes Place in Shenzhen
On September 22, the Press Conference for the Consumer Electronics Innovation Congress 2026 (CEIC 2026) was held in Shenzhen. The conference announced that themed "Innovation for Infinity," this year's event is co-hosted by the Hetao "6+1" International Industry and Standards Organizations and the Centre for International Industrial and Technical Cooperation of the Ministry of Industry and Information Technology (MIIT). It is scheduled to grandly open on October 22 in Hall 9 of the Shenzhen Convention and Exhibition Center (Futian).
Connecting technological innovation with people's livelihoods, consumer electronics represents the most active domain for the transformation of information technology. Currently, the global consumer electronics industry is entering a new era of profound transformation. Deepening efforts in underlying root technologies, formulating industry standards, and driving the leap from "Made in China" to "Created in China" and ultimately to "International Standards" constitute the essential path for industrial upgrading. CEIC 2026 will upgrade into the flagship innovation exhibition and industrial portal for consumer electronics in the Asia-Pacific region.
This year's conference forums have been comprehensively upgraded. The Main Forum will invite academicians from home and abroad, leaders of international authoritative organizations such as IEC, ITU, and ETSI, as well as senior executives from top-tier enterprises, to focus on cutting-edge industry trends. The Hetao "6+1" Standards Industry Alliance will release international progress and core achievements, while hosting more than 20 parallel forums on cutting-edge technology.
Relying on an exhibition space of 20,000 square meters, the congress has confirmed participation from over 300 leading technology enterprises and emerging tech-innovation brands. These cover benchmark players in various sectors—including China Media Group (CMG), China Mobile, Huawei, Honor, Lenovo, Haier, Midea, HiSilicon, NIO, XPeng, GAC Group, Dassault Systèmes, Cambridge Industries Group (CIG), EHang, Zero-G Aircraft, Beijing Embodied Intelligence, Qiyuan, AgiBot, Fourier Intelligence, Shengyan Zhixin, Huakun Zhenyu, xFusion, and Shenzhen OpenHarmony—as well as vibrant AI consumer hardware startup communities like Chase Light Group and Pojie Workshop.
The event will also feature a specialized "Innovation PARK" exhibition area, host signature activities such as the Vivid Immersive Park and the National Finals of the 3rd "SparkLink OpenHarmony Cup" Application Challenge, and collaborate with Shenzhen Satellite TV to build the "Open Stage."
At the press conference, organizers and guests previews the core highlights of the congress across three dimensions, centered around the event theme:
Infinite Innovation Momentum: Concentrated Debut of World-First and Industry-Pioneering Benchmark Achievements Yang Tao, Deputy Director of the CEIC Organizing Committee, introduced that this edition will feature the concentrated release of a batch of world-first, national-first, and industry-pioneering benchmark outcomes.
For example, in the audiovisual and imaging domain, the World Ultra HD Video Industry Alliance (UWA) will release the world's first spatial imaging standard, alongside the concentrated deployment of multiple achievements. In the AI computing domain, CMG Big Model 3.0 will be upgraded, Global Computing Power Top 10 Trends 2027 will make its debut, and the Supernode Definition and Practice White Paper will be upgraded and released. In the chip domain, five mainstream chip manufacturers will collectively launch SparkLink 2.0 chips, and the Beijing Chip IP OpenLab will be officially awarded. In the next-generation network domain, the Network 2030 Research Report will be officially published.
Zeng Guosong, Secretary-General of the International SparkLink Alliance, stated that with the rapid growth of AI agents and embodied intelligent devices, the innovation of underlying wireless connection technologies has become an inevitable requirement for the intelligent upgrading of consumer electronics. During the congress, the Alliance will host the 2026 SparkLink Industry Summit & SparkLink Ecosystem Innovation Exhibition, unveiling for the first time SparkLink 3.0's core technical layout for the AI era; launching for the first time the SparkLink Connectivity Kit for intelligent agents and embodied intelligent devices to achieve low-latency, integrated communication-positioning-sensing smart connectivity; and presenting for the first time the comprehensive outcomes of cross-ecosystem fusion between SparkLink and OpenHarmony.
Infinite Innovation Boundaries: Six International Alliances Anchored, Global Ecosystem Co-Building Accelerated With the Hetao "6+1" International Industry and Standards Organizations as its hub, CEIC links over 3,000 global member enterprises, seamlessly connecting the full digital foundation spanning chips, operating systems, computing power, communications, IoT, and smart terminals, creating a three-in-one closed-loop ecosystem for developers, industrial support, and global buyers.
Focusing on the formulation of international industrial rules, the deployment of industry standards, and the co-building of global ecosystems, this year's congress demonstrates China's voice and leadership in the global consumer electronics domain through standards.
Hu Caiyong, Secretary-General of the Global Intelligent Internet of Things Consortium (GIIC), introduced that GIIC is deeply involved in the planning of the congress and will lead three thematic forums and set up three specialized exhibition areas. Multiple representative enterprises will showcase their latest achievements, presenting a real-world experience of the Intelligent Internet of Everything.
As an enterprise member representative of the alliance, Chen Rong, General Manager of Shengyan Zhixin, stated that the research, development, and industrialization of root technologies for short-range connectivity cannot be accomplished by a single enterprise alone; it requires full-chain synergy from standard refinement to mass production. After joining the alliance, the enterprise participated in standard discussions in advance and quickly matched with chip manufacturers to complete joint debugging and verification of low-latency acoustic sensing solutions, significantly compressing the product deployment cycle. He believes the alliance is becoming an industry accelerator, and Shengyan Zhixin will continue to collaborate with industry chain partners to reinforce weak links, expand application scenarios, strengthen root technologies, and enrich the industrial ecosystem.
Infinite Innovation Possibilities: Future Smart Mobility and All-Scenario Smart Life Open New Frontiers CEIC 2026 lists future smart mobility as a key track for the first time, gathering benchmark enterprises such as EHang Intelligent, Zero-G Aircraft Industry, and Huawei Qiankun, covering eVTOL low-altitude aircraft, high-end intelligent cockpits, and all-scenario Connected Vehicle solutions, showcasing the cross-boundary fusion of consumer electronics technology into low-altitude mobility and smart vehicles. Simultaneously, it brings together institutions such as China Mobile Smart Home and Malanshan Audio & Video Lab, leveraging Audio & Video Vivid technology to bring multi-scenario immersive audiovisual innovation, driving cutting-edge technologies from standards R&D to commercial application closed loops.
Li Nijun, Chief Marketing Officer of Zero-G Aircraft Industry, pointed out that although they have not yet joined the alliance membership system, they have already directly experienced CEIC's open posture. "We come with three expectations: understanding standards so our products iterate on the right track; connecting with the ecosystem to meet like-minded partners upstream and downstream in the industry chain; and showcasing and collaborating to present Zero-G's accumulation across dual technical routes, finding partners to solidly build the low-altitude economy together."
Sun Huaqing, Deputy Director of the Centre for International Industrial and Technical Cooperation of MIIT, stated that currently, driven by new-generation information technologies such as artificial intelligence, China's consumer electronics industry has shifted from a capacity- and price-driven paradigm to an innovation-driven one. Characterized by root technology driving, standards leading, and ecosystem synergy, CEIC is dedicated to becoming a "digger at the source of innovation," propelling locally led international standards to go global. The year 2026 marks the beginning of the 15th Five-Year Plan. The 2nd CEIC will adhere to the directions of intelligence, greening, and integration, focusing on the three keywords of "Root Technology, Innovation, and Standards," fully presenting new trends in consumer electronics development across all scenarios.
In this golden October, CEIC 2026 cordially invites global innovators and consumers to gather in Shenzhen to jointly explore innovative technologies, experience innovative products, and define new trends in consumer electronics together!
CEIC 2026: Trends in Innovation
About CEIC
The Consumer Electronics Innovation Congress (CEIC) is a root-technology industry event rooted in China and serving the world. Driven by its core mission to "Jointly Define New Trends in Consumer Electronics," CEIC covers domains spanning root technologies, core components, smart terminals, all-scenario applications, and industrial ecosystems. It builds a one-stop platform for technology releases, product showcases, industrial seminars, investment and financing matchmaking, and international cooperation, continuously driving the AI intelligent transformation and global collaborative development of the consumer electronics industry. Sayece (Shenzhen) Technology Service Co., Ltd. serves as the operating entity for CEIC. The Consumer Electronics Innovation Congress 2026 is scheduled to be held from October 22 to 24 at the Shenzhen Convention and Exhibition Center (Futian). Industry colleagues are cordially invited to participate actively.
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