Network Innovation and Development Alliance

HIGHLIGHTS

新闻资讯
NEWS

Focusing on Scenario Requirements and Technical Challenges of 100Mbps Single Pair Ethernet: The Second Event of the Zhiyao Salon "Interconnecting All Industries" Series Held Online

On September 28, 2026, the second event of the "Zhiyao Salon · Interconnecting All Industries" series, hosted by the Network Innovation and Development Alliance (NIDA), was held online under the theme "Exploring Demand: Scenario Requirements and Technical Challenges for 100Mbps Single Pair Ethernet." The salon was hosted by Li Guangpeng, Zhiyao Network expert at NIDA, with opening remarks delivered by Liu Changlong, Director at the Network Communication Research Institute of China Electronics Technology Group Corporation (CETC). Keynote presentations were delivered by Hu Yongkang, Senior Engineer at the Instrumentation Technology and Economy Institute (ITEI); Chen Dongfei, Vice General Manager of Nantong Haishi Optoelectronics Co., Ltd.; and Tan Yuxuan, Standards Engineer at Yutai Microelectronics Co., Ltd. Over 30 attending members engaged in an open discussion surrounding scenario requirements and technical challenges.Single Pair Ethernet (SPE) breaks through traditional Ethernet limitations of "four pairs/eight cores with a maximum length of 100 meters," enabling data communication and Data Line Power (PoDL) over just a single twisted pair. In June 2026, IEEE 802.3dg-2026 was officially published, boosting single-pair speeds to 100 Mbps and extending transmission distances up to 500 meters. This forms a complementary capability matrix with Ethernet-APL's intrinsically safe low-speed route (10 Mbps, 1,000 meters)—establishing a dual paradigm of "intrinsically safe low-speed" and "non-intrinsically safe high-speed"—and ushering in a new era for 100Mbps long-reach Single Pair Ethernet.Figure 1 Dual Technical Routes of Single Pair Ethernet: Ethernet-APL Intrinsically Safe Low-Speed vs. IEEE 802.3dg-2026 Non-Intrinsically Safe High-Speed (Source: Hu Yongkang's Presentation)In his presentation titled Reflections on the Application of Single Pair Ethernet (SPE) Technology in Process Industries, Hu Yongkang pointed out that process industries have long relied on 4-20mA analog signals and low-speed fieldbuses with typical speeds of just 31.25 kbps. Existing technologies struggle to simultaneously satisfy the twin demands of "long distance + high bandwidth," making SPE widely recognized as the cornerstone for digital transformation in process industries. He introduced five benchmark application scenarios: remote real-time monitoring and dispatch of smart instruments, machine vision process status monitoring, multi-node data aggregation for remote I/O, integrated video and control in high-risk zones, and predictive maintenance & remote O&M. Citing market data showing that industrial Ethernet accounts for 79% of the market with a 12% annual growth rate, he noted that SPE—carrying all protocols over a single pair—is poised to drive the physical layer of industrial Ethernet toward unification. He stated that China has established a comprehensive layout covering chips, instruments, switches, DCS, and application deployment, with policy guidance and ecosystem synergy advancing together; however, a gap remains with leading international vendors in the 100 Mbps direction.Chen Dongfei shared Ethernet transmission practices for edge intelligent visual instruments tailored for fine chemical scenarios. He highlighted three long-standing pain points in chemical processes—such as extraction stratification, reaction kettle status monitoring, and pipeline blockage detection—which have relied heavily on manual visual inspection, resulting in strong subjectivity, delayed response, and personnel exposure in high-risk environments. Meanwhile, traditional architectures combining "explosion-proof cameras + centralized server analysis" face three dilemmas: insufficient real-time capability, a trade-off between cost and efficiency, and concentrated reliability risks. Edge intelligent visual instruments execute image acquisition, spectral analysis, and AI recognition locally with a response time under 200 milliseconds, leaving the network to carry only detection results and real-time video streams. He emphasized that "10M being enough is an illusion": as resolutions scale to 4MP and 8MP alongside parallel data streams, 10 Mbps bandwidth quickly becomes a bottleneck. Long-reach 100Mbps Single Pair Ethernet—combining 100Mbps bandwidth with long-distance power supply—serves as the true long-term infrastructure for visual instrument data value.Figure 2 Comparison between Edge Intelligent Visual Instruments and Traditional Centralized Processing Architectures (Source: Chen Dongfei's Presentation)Tan Yuxuan systematically outlined the standards and application landscape of automotive 100Mbps Single Pair Ethernet. She explained that IEEE 802.3bw (100BASE-T1) relies on key physical layer technologies such as hybrid/echo cancellation and MASTER-SLAVE modes to satisfy stringent automotive EMC requirements while achieving harness weight reduction and cost control, delivering high-speed data transmission over a single pair of twisted wires. Nationally, the recommended automotive industry standard Technical Requirements and Test Methods for Automotive Ethernet 100Mbps Physical Layer Interface (PHY) Chips (QC/T 1286—2026) was released on June 1, 2026, and will be implemented on December 1, 2026, marking China's first industry standard specifically tailored for automotive single-pair 100Mbps PHY chips. Furthermore, the national standard series Road Vehicles — Automotive Ethernet (identically adopting ISO 21111) is currently in the approval pipeline, signaling the rapid maturation of China's automotive SPE standard system.Figure 3 Evolution of IEEE 802.3 Automotive Single Pair Ethernet Standards (Source: Tan Yuxuan's Presentation)During the open discussion, attending members exchanged deep insights on scenario requirements, power delivery capabilities, intrinsic safety compatibility, and chip industrialization for 100Mbps Single Pair Ethernet. The salon reached a clear consensus: the release of the 100BASE-T1L standard fills the gap between the two existing routes of "10M long-reach" and "100M short-reach," addressing a clear and urgent demand for long-reach 100Mbps SPE in process industries and fine chemicals. NIDA will continue organizing technical salons to gather industrial strength, promote ecosystem deployment, and accelerate standards formulation.
2026-09-29
12

400G per Lane MSA Announces Project Progress and Future Outlook for Single-Lane 400G Active Electrical Cable Technical Specification Targeted at 3.2T Ethernet

[Shenzhen, China, September 10, 2026] During the 27th China International Optoelectronic Philosophical Exhibition (CIOE 2026), the Network Innovation and Development Alliance (NIDA) successfully hosted the "400G per Lane MSA Deliverables Release and High-Speed Optoelectronic Interconnect Technology Seminar." The NIDA 400G per Lane MSA, spearheaded jointly by China Mobile Communications Group Co., Ltd. and Huawei Technologies Co., Ltd., officially released the initial version of the first single-lane 400G Active Electrical Cable (AEC) technical specification.Relying on NIDA, the 400G per Lane MSA was initiated and established in September 2025. Currently, it boasts over 30 members, encompassing nearly end-to-end industry chain participants including research institutes, operators, cloud service providers, equipment vendors, as well as chip, instrument, and meter manufacturers. Following the global release of the Single-Lane 400G Ethernet Physical Layer Whitepaper in April this year, this CIOE event marks another major milestone announcement by the 400G per Lane MSA, solidifying the foundational technology for 3.2T Ethernet in next-generation AI computing centers. High-speed 3.2Tbps Ethernet technology will undoubtedly become the primary technology for both intra-center and inter-center interconnectivity in future AI computing centers. NIDA's underlying Data Center Working Group, Network Evolution Working Group, Campus Network Working Group, Autonomous Network Working Group, and Cybersecurity Working Group cover virtually all horizontal network components. While refining its own technical endeavors, the 400G per Lane MSA will collaborate with other working groups to drive the end-to-end implementation of standards and specifications across network construction, maintenance, and optimization!The publicly released Single-Lane 400G Active Electrical Cable (AEC) Technical Specification was primarily drafted by experts from member units including China Mobile and Huawei. It systematically defines the overall architecture and a complete set of electrical parameters for active electrical cables tailored for 400G per Lane signal transmission, fully supporting Ethernet transmission from 400GE to 1.6TE and future 3.2TE, providing the industry with a feasible option for single-lane 400G AEC interconnect technical specifications. Regarding software and hardware architecture, the specification defines the functional composition and working modes of active electrical cables, supporting combinations of multiple Forward Error Correction (FEC) coding techniques to adapt to different application scenarios. In terms of electrical parameters, the specification establishes a comprehensive set of performance metrics covering the transmitter, receiver, and full-link channel, while groundbreakingly defining three cable insertion loss tiers based on DSP performance and capabilities, fully accommodating varying transmission distance requirements from 1 meter to 2 meters and beyond 2 meters. Adopting mature industry measurement and testing methodologies wherever possible, the specification defines compliance test points and criteria at both host and module ends, ensuring interoperability among products from different vendors, making "testable and interoperable" an inherent, rigid requirement right from the inception of the standard. This specification provides chip, cable, and module manufacturers with a complete technical solution and unified R&D targets to directly guide their product development, boosting the global growth of the high-speed Ethernet interconnect industry for AI computing centers.Single-lane 400G technology serves as the physical layer cornerstone for 3.2T Ethernet. As AI large model parameters surpass tens of trillions, demand for high-speed interconnects among GPUs in AI computing centers is growing rapidly, driving Ethernet port speeds toward 3.2T. The interface rate foundation relies on SerDes single-lane speeds: current 800G Ethernet is combined from eight 100G SerDes lanes, 1.6T Ethernet from eight 200G SerDes lanes, and future 3.2T Ethernet will be combined from eight 400G SerDes lanes. Crucially, although upper-layer technical approaches differ across AI computing center interconnect organizations such as InfiniBand, UALink, UEC, and UB, their foundation all relies on high-speed SerDes. Elevating the SerDes single-lane rate from 200G to 400G yields immense practical value for these various interconnect technologies.To aggregate contributions from all end-to-end industry chain parties and jointly advance 400G per Lane technology toward maturity and ecosystem synergy, the 400G per Lane MSA held the High-Speed Optoelectronic Interconnect Technology Seminar alongside the project progress announcement. The seminar invited authoritative experts from domestic and international research and industrial institutions, operators, cloud service providers, equipment vendors, as well as chip and test instrument manufacturers—including China Mobile Research Institute, Huawei, CAICT, ZTE, Alibaba, Keysight Technologies, MultiLane, Jiyi Micro, and VIAVI Solutions—to engage in deep discussions regarding standards, technologies, testing, and industrial synergy for next-generation high-speed interconnects. Covering the entire industry chain from "Chip—Module—System—Test—Operation," the seminar represents a crucial step for 400G per Lane technology moving from specification text to engineering implementation, and from industry consensus to ecosystem synergy, which will greatly accelerate the industrial maturity and large-scale deployment of 400G per Lane technology.The 400G per Lane MSA continuously attracts and gathers industry partners to promote the development of 400G per Lane Ethernet technology. Established under the NIDA framework in 2025, the MSA brings together over thirty leading enterprises in the high-speed interconnect field to jointly formulate 400G per Lane technical specifications and drive industry deployment. Advancing from a white paper to technical specifications, and further to full-industry-chain technical seminars, the 400G per Lane MSA is steadily propelling this technology from concept to realization, and from standards to ecosystem formation. Moving forward, the 400G per Lane MSA will continuously refine technical specifications, promote interoperability testing and verification among related manufacturers, and foster an open, collaborative ultra-high-speed Ethernet interconnect ecosystem, building a high-speed interconnect foundation for next-generation AI computing centers and accelerating the high-quality development of AI computing center infrastructure.
2026-09-17
50

Physical AI Becomes Reality: Integrated Sensing and Communication Technology and System Seminar Successfully Concludes

Official English Translation [Chengdu, China, September 12] The Integrated Sensing and Communication (ISAC) Technology and System Seminar was successfully held at the Chengdu Europe Center. Jointly organized by the International Society of Smart Sensing Technology (ISST) and the Network Innovation and Development Alliance (NIDA), the seminar was themed "Overcoming Industrial Barriers to ISAC Deployment and Serving Industry Applications." Attending academicians, university researchers, and industry chain practitioners focused on real-world issues such as technical bottlenecks, standards synergy, business models, and ecosystem co-construction, with a dedicated focus on driving ISAC technology from laboratories toward large-scale industrial applications.Above: Group photo of all seminar participantsAcademician Wu Ke delivered a keynote speech titled Wireless Intelligence and Physical AI. The report outlined the evolution of wireless technologies and interpreted the upgrade logic from software AI to physical AI. It systematically introduced hardware iterations for ISAC, software-hardware co-design, and various intelligent agent application frameworks, while sharing long-term forward-looking research outcomes from the research team—noting that several early-stage layout technologies have now become industry hotspots. Based on the evolutionary patterns of radio frequency (RF) technology, Academician Wu proposed a visionary framework for the grand unification of future wireless technologies, while reminding the industry to evaluate technology maturity objectively and rationally.Above: Photo of Academician Wu Ke delivering his speechAcademician Sun Lining delivered a report titled Sensing Technology for Embodied Intelligent Robots. Aligning with national strategic policies such as the 15th Five-Year Plan and MEMS major projects, the report clarified the crucial industrial value of micro-nano sensing technology. It introduced the architecture of intelligent robot systems and explained the core principles of using micro-nano sensing to build embodied sensing neurons. The report defined the mainstream trends of sensing technology iterating toward miniaturization, integration, and intelligence across multiple robot sensing directions. Drawing on real-world cases such as surgical robots and dextrous hands, Academician Sun analyzed current technical shortcomings and deployment bottlenecks in the intelligent sensing field.Above: Photo of Academician Sun Lining delivering his speechLi Guangpeng from the Network Innovation and Development Alliance delivered a report titled Enabling Industrial Intelligence—Introduction to Zhiyao Network Technology and Industry Ecosystem Development. The report pointed out that core pain points in physical AI deployment stem from missing industrial interfaces and insufficient industry domain data. It detailed the core technical architecture of Zhiyao Network's integrated transmission and power supply capabilities alongside its multi-scenario adaptability. Leveraging innovation cases of Zhiyao Network in the petroleum and petrochemical industries, the report validated the technology's empowering effect on industrial data collection and industrial intelligence, while highlighting the efforts of NIDA and its Zhiyao Network Professional Committee in advancing standards co-construction, ecosystem cultivation, and the construction of localized industrial network systems.Above: Photo of Li Guangpeng, Expert of NIDA Zhiyao Network Professional Committee, delivering his speechBai Xiaofei from Huawei presented a report titled Huawei Data Communication WLAN+X ISAC Exploration. The report explained the overall technical philosophy of WLAN+X sensing convergence, constructing a multi-dimensional short-range wireless application framework. Comparing differences among mainstream sensing technical routes, it showcased multiple mature commercial deployment projects. It candidly outlined real-world engineering challenges such as signal interference, recognition errors, device design, and cost control. Furthermore, it proposed industry-univ-research collaborative breakthroughs to overcome technical deployment barriers and accelerate the large-scale industrial development of ISAC.Above: Photo of Bai Xiaofei, WLAN Domain Expert at Huawei, delivering his speechAt noon, organized by the Chengdu Association for Science and Technology, representatives from ISST, NIDA, Qingyang District, China Mobile Chengdu Research Institute, and relevant enterprises held a targeted discussion on the industrial deployment of ISAC and Zhiyao Network in Chengdu, planning to initiate concrete demand research as the next step.From 14:00 to 17:00 in the afternoon, during the open discussion session, experts from industry and academia engaged in deep, pragmatic exchanges with the two academicians regarding technical deployment bottlenecks, standards co-construction, business models, and industrial ecosystems. Addressing various industry pain points raised on-site, Academician Wu Ke and Academician Sun Lining consistently grounded their guidance in practical issues, offering professional direction and constructive insights across ISAC concept definitions, industry talent gaps, and enterprise transformation pathways, deeply tapping the potential for industry-univ-research collaboration.This seminar was compact and pragmatic. The two academicians presented comprehensive outlooks on academic development trends related to the two hot industries of ISAC and embodied robotics. Subsequently, two industry experts invited by NIDA elaborated on the concrete deployment progress in these two directions and reported on the establishment of the Wireless Intelligence Sensing and Industry Alliance (WISIA) and the Zhiyao Network Professional Committee under NIDA.During the seminar, attending experts and enterprise representatives expressed an urgent desire for practical innovation cases in technology deployment! Moving forward, NIDA will focus on the two technology and industry development directions from this seminar, prioritizing efforts to drive industry partners to focus on the landing of innovative cases. Based on new demands emerging from the innovation process, these insights will be fed back to relevant industry-univ-research units within ISST, thereby achieving iterative technical innovation and fostering the spiral growth and expansion of the industry!Once again, sincere thanks to Shan Huimin, Secretary-General of the International Society of Smart Sensing Technology, for the meticulous organization, as well as to the two academicians and all experts for their valuable insights!
2026-09-15
35

NIDA & AP IPv6 Experts Share 2030 Network Evolution Roadmap for Vietnam Digital Economy

[Ho Chi Minh, Vietnam, 19 June 2026] The Vietnam Internet Conference 2026 was held in Ho Chi Minh City from June 16 to 19. The summit focused on how next-generation internet infrastructure supports emerging applications such as artificial intelligence (AI). Over 200 representatives attended the event, including officials from Vietnamese regulatory authorities, domestic telecom operators, universities, Southeast Asian ICT enterprises, and international standards organizations. During the main forum on June 19, Dr. LIU Shucheng, Director of the Industrial Development Department at the Network Innovation and Development Alliance (NIDA) and Vice Chairman of the APAC IPv6 Council, delivered a keynote speech. He shared insights into the network evolution roadmap toward 2030 and proposed a new network foundation characterized by high speed, high quality, and high security, providing actionable references for digital transformation in APAC.Accelerated AI Deployment Drives Comprehensive Restructuring of Underlying Network ArchitectureAI has been elevated to a national strategic priority for major global powers. China, the United States, and multiple European countries have introduced top-level AI development plans, while emerging markets such as Saudi Arabia, Indonesia, and Egypt have successively released dedicated national AI strategies and ramped up investments in the digital industry. Omdia predicts that AI will drive rapid revenue growth in the ICT sector. The AI boom is generating massive volumes of data, leading to increasingly stringent data security requirements across key industries. Traditional bearer networks must not only enhance bandwidth and service quality but also strengthen security protection capabilities. Furthermore, data center networks must achieve congestion-free scheduling and proactive security isolation.According to Roland Berger, IPv6 Enhanced, leveraging four core capabilities—SRv6, network slicing, digital twin, and autonomous driving networks—can simultaneously expand network access scale, optimize service quality, and streamline operation and maintenance processes. It is projected that global technological innovations related to IPv6 Enhanced will generate $10 trillion in economic value by 2030.In the realm of standardization, the ITU-T has published the Y.3188 standard to define network requirements for AI scenarios and has initiated the drafting of a 2030 technical report targeting the 6G and Agentic AI era. The WBBA, in collaboration with over 200 industry members, has put forward an end-to-end network architecture based on IPv6 Enhanced. This architecture encompasses metro & backbone networks, data center networks and campus/enterprise networks, integrating core technologies such as SRv6, 400/800GE, and Wi-Fi 7. NIDA and APAC IPv6 Council have established five standardization working groups focusing on network evolution, autonomous networks, campus networks, data center networks, and network security. These groups are developing comprehensive network construction standards centered on high speed, high quality, and high security.Localized Solutions Tailored to Vietnam's Digital Infrastructure UpgradeBased on Vietnam's current industrial landscape, Dr. Liu proposed a series of actionable recommendations to comprehensively support local AI development. These include upgrading 400GE IPv6 Enhanced metro & backbone networks, promoting Wi-Fi 7 10Gbps campus/enterprise networks, deploying 800GE lossless computing data center networks, and scaling up direct fiber connections for FTTS base stations.Addressing network security challenges in the AI era, the layered defense system of IPv6 Enhanced integrates an AI traffic detection engine. This enables real-time monitoring at the second level and rapid disposal of non-compliant information, fully aligning with network regulatory and compliance requirements across various countries.With top-level IPv6 policy planning in China and France as representative case studies, the speech vividly demonstrated the driving value of high-speed intelligent networks for the digital economy, offering valuable insights for Vietnam and other Southeast Asian nations.Deepening Regional Standardization Cooperation to Solidify the Foundation for 2030 Digital DevelopmentIn his concluding remarks, Dr. Liu emphasized that NIDA and APAC IPv6 Council are open and inclusive international standards organizations that have previously established partnerships with local standards bodies in countries such as Indonesia and Kazakhstan. Looking ahead, the Alliances are willing to deepening collaboration with local standards and industry organizations of Vietnam and other APAC countries to jointly develop localized network development guidelines, thereby helping Vietnam comprehensively enhance the competitiveness of digital infrastructure. The Alliance also welcomes more global partners to join forces in advancing the digital and intelligent transformation of society.
2026-06-30
100

NIDA, Huawei, the hotel industry association, and other organizations jointly released the Blue Book on 10G AI Peace of Mind Hotel to build a new benchmark for hotel digitalization.

[Sanya, China, November 26] China Hotel & Restaurant Brand Development Conference and China Hotel Industry Digital Development Forum were held. The forum was held with the theme of "Man-Machine Synergetic Intelligence Native - AI Innovation and Practice in the Hotel Industry" to deeply analyze the development trend of AI application in the accommodation industry. Comprehensively demonstrate the application achievements of current AI scenarios. The Network Innovation and Development Alliance (NIDA), a core driver of digital-intelligent transformation in the hotel industry, has been unveiled at the forum. Through the joint release of the high-quality 10GE hotel network construction blue book, the NIDA will build ICT infrastructure suitable for the hotel industry with the Star River AI peace of mind hotel solution as the core. Leading the digitalization of hotels, culture and travel.Partners who participated in the forum agreed that hotel digitalization has become the "new normal" in the industry and that ICT infrastructure is the core cornerstone of hotel digital transformation. Based on the in-depth insight into the hotel industry, he pointed out the industry vision of "building a solid digital foundation for hotels and building a smart growth engine", focused on three core requirements of "service digitalization, operation digitalization, and marketing digitalization", and deeply integrated technologies such as connectivity, computing, cloud, and AI into hotel scenarios. As the hotel campus network has entered the era of AirEngine Wi-Fi 7 coverage, wired and wireless dual 10GE access must meet network standards in the AI era. The CSI synaesthesia technology integrates the IoT intelligent control system to implement temperature adjustment in the hotel guest control system, saving 20% energy. The rogue camera detection function provides 24/7 surveillance and 100% mainstream camera identification, ensuring privacy and security of guests. This series of functions has been recognized by hotel chains, hotel regulators, hotel industry alliances and so on, and is expected to become an important new standard for hotel network construction, namely, "easy hotel".Subsequently, the Blue Book on High-Quality 10G AI-enabled Hotel Network Construction Technology, which was co-authored and released by NIDA, Huawei, and the Hotel Industry Association, not only covers high-quality network construction driven by AI. The innovative integration of key technologies, such as 10GE wireless, PEN Ethernet all-optical architecture, all-domain security, application experience assurance, energy saving, and intelligent O&M, provides the digital intelligence foundation of "simplified architecture + ultimate experience + all-domain security" for the digital transformation of hotels. At the same time, emphasis is placed on "Reassuring Hotel", as the hotel network construction standard important innovation!In the demonstration vehicle, the CSI-based electromagnetic sensing technology was demonstrated to implement illegal camera detection, achieving 24/7 monitoring and 100% mainstream camera identification, and building a secure line of defense for privacy and security of guests. Leaders and guests from various provinces and hotel chains attended the conference were very interested in seeing the demonstration in the demo truck. They directly asked about the deployment cost of the entire solution and the accuracy of camera detection. As a driver of campus network technologies and industries in China, NIDA has worked with Huawei and other partners to promote the implementation of the technology in the wireless intelligent sensing industry ecosystem.
2025-12-09
405

Three new alliances were formally established, and the Hetao International Industry and Standards Organization Gathering Area was unveiled in 2024 MWC Shanghai.

During the 2024 Mobile World Congress in Shanghai (2024 MWC Shanghai), the Hetao International Industry and Standards Organization Cluster (Hetao Cluster for short) made its first collective appearance to comprehensively showcase its new platform, capabilities, and advantages. To convey to the industry the radiation role of "based on Hetao and facing the world" in Hetao agglomeration area, aiming to drive standard innovation and industrial development in related fields. The Hetao Gathering Area booth is rich in content and attracts many partners and visitors from all over the world. At the same time,hetao gathering area exhibition area gets the attention of leaders. Zhang Gang, former counselor of the State Council and deputy director of the China Standardization Expert Committee, visited the latest achievements and progress of Hetao Gathering Area. Hetao Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone Director of Shenzhen Park Development Department Zeng Jianpeng, Shenzhen Municipal Bureau of Industry and Information Technology Deputy Director Lin Yi promoted Hetao cluster area on the spot. "1+6" first collective debut to share a new chapter with global audiences Hetao Gathering Area was officially unveiled in January 2024. It is located in the Hetao Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone, which is an international industry and standards organization gathering area set up in Shenzhen Park, which is adjacent to Hong Kong. In this exhibition, Hetao Gathering Area for the first time to fully display the "1+6" international organizations and service institutions. "1" stands for the service center and capability back-end - the co-entropy industry and standard innovation service center; "6" stands for the World Wireless LAN Application Development Alliance (WAA), the International Starflash Wireless Short-Range Communication Alliance (SA), and the World Ultra HD Video Industry Alliance (UWA). and the newly established Global Computing Alliance (GCC), Global Intelligent Internet of Things Alliance (GIIC), and Network Innovation and Development Alliance (NIDA). At the exhibition, the alliance of organizations in Hetao cluster area not only showcased the latest standards, white papers, member organizations, and representative products and solutions, but also set up typical application scenarios to demonstrate their technical capabilities and advantages through familiar and intuitive user experience. The World Wireless LAN Application Development Alliance ( booth collects eight published standards, two industry development white papers, and five product certifications. Currently, WAA has a complete test and certification system, and the test and certification work is ready. The test and certification services will be launched in the second half of this year. WAA showcased a number of innovative networking-related products at the booth. Among them, five wireless routers have passed the test and obtained the WAA certification, and support all functions of WiFi6. In addition, Canxin, a member of the alliance, also demonstrated the Flexwall-100 high-density real physical layer emulator in the campus scenario test system CSWIFI600, which is provided by the WAA test platform.staff members introduced the detailed functions of the Flexwall-100 high-density real physical layer simulator to the participants. Ultra HD Video Industry Alliance (UWA ) :) has released two ultra HD technical standards, HDR Vivid and Audio Vivid, which have become industry standards for broadcasting and television. HDR Vivid has become the standard of both Industry Information Technology and Broadcasting and Television. At the exhibition, UWA carefully set up the " WAA ) : WAA wireless home audio and video experience room", the Samsung 85-inch NeoQLED TV certified by HDR Vivid, and the 7.1.4 three-dimensional sound field demonstration scenario built by the new generation of wireless short-range communication technology, Starflash. Let live audiences experience the immersive audio-visual experience of dual Vivid and Starflash technology standards. International Star Flash Wireless Short-Range Communication Alliance (SA ) :) is dedicated to promoting the innovation and industry ecosystem of SparkLink, a new-generation wireless short-range communication technology. At present, Starflash Alliance has more than 1000 members, and has launched more than 150 products or solutions in the mass consumption and enterprise commercial markets. At the 2024MWC Shanghai, the Starflash Alliance showcased smart devices, smart cars, smart homes, smart office, and industrial applications with the theme of "people", "car", "home", and "park". In addition, participants can experience the advantages of "low latency, high concurrency, fine synchronization, anti-interference, and high reliability" of the Starflash technology in real life scenarios.attendees are watching the Starflash Smart Park built based on 5G + Starflash short-distanceGlobal Smart IoT Alliance (GIIC ) :) is dedicated to building a technology-leading IoT ecosystem based on open-source and open operating systems and open and interconnected standards to promote the high-quality development of the global smart IoT. The establishment of GIIC is of great significance to improve the competitiveness of China's intelligent terminal operating system. It will provide strong support for the development of China's intelligent terminal industry by promoting innovation capability breakthroughs in the entire industry chain, enhancing industrial agglomeration benefits, facilitating product testing and certification, and strengthening international exchanges and cooperation. In addition, GIIC will help China improve its voice in global smart device standards and build an international multilateral cooperation platform for global standards research, industry development, and academic exchanges. At the GIIC Alliance exhibited 33 standards that have been initiated, including connection, security, testing, AI, and engineering directions for smart home interconnection. In addition, a complete product certification system has been set up to ensure the quality of GIIC products.audiences learn about GIIC-related products and solutions. Network Innovation and Development Alliance (NIDA ) :) is an international, industrial, and non-profit organization that is voluntarily established by industry institutions, universities, research institutes, and companies around the world and focuses on promoting fixed network technology innovation and industrial upgrading. NIDA is committed to defining the evolution path and network construction standards of global Internet infrastructure to guide the innovation and upgrade of the Internet infrastructure industry. At the booth, NIDA presented the white papers and solutions related to fixed networks, showing the achievements in network standard construction. The Global Computing Alliance (GCC ) :) is committed to promoting open innovation in the computing industry, building a robust and prosperous ecosystem, and supporting the sustainable development of the digital and intelligent society with the vision of "openness, innovation, collaboration, and development". At the exhibition, GCC demonstrated the demo model of the diversified peer-to-peer computing architecture, which vividly demonstrated the features and advantages of the new computing architecture and clearly demonstrated the three core business directions of GCC: Promote industry consensus on peer-to-peer computing architectures and unleash new computing vitality. Build a new computing standard system to support the implementation of standard consensus. Use multiple methods to build a robust and prosperous new computing ecosystem. Co-entropy Industry and Standards Innovation Service Center ( Comentropy ) : Co-entropy Service Center aims to provide all-round, three-dimensional, and professional basic services for the establishment, operation, and development of international industry and standards organizations. The Co-Entropy Service Center introduced AllianceHub, a self-developed IT platform, to provide service bearing and online management functions for international alliances and social organizations, helping to solve specific challenges in the work of international organizations. At the same time, also announced the Guide to International Organizations to be released in July this year, covering the entire life cycle of international organizations. Preparation period, organization establishment period, business growth period, mature operation period, and development and evolution period. Using this guide well, the organization is equivalent to having a detailed reference book, practical training course, and easy-to-use template set. Bridges the World and Builds a Better Future As an international industry and standards organization gathering area, Hetao gathering area has proved its capabilities and advantages in promoting standards innovation and industry development through its own innovative exploration and practice. Up to now, the international industry and standard alliances of Hetao agglomeration area have accumulated fruitful achievements: Drafted 130 standards, published 23 white papers, tested and certified 211 products, and developed 1,643 members. "based on Hetao, facing the world". During the 2024MWC Shanghai, the Hetao Gathering Area presented in a "1+6" matrix to comprehensively and intuitively demonstrate to the audience the new capabilities and advantages of new connections, new media, new computing, new terminals, and new platforms. Discuss the future trends of the industry and standards with the industry, and jointly promote standards innovation and industry development in related fields around the world by connecting with the global ecosystem.
2024-06-27
450
精彩活动
ACTIVITY

“Love Innovation, Endless Intelligence”: CEIC 2026 Set to Unveil as the Consumer Electronics Innovation Conference 2026 Press Conference Takes Place in Shenzhen

On September 22, the Press Conference for the Consumer Electronics Innovation Congress 2026 (CEIC 2026) was held in Shenzhen. The conference announced that themed "Innovation for Infinity," this year's event is co-hosted by the Hetao "6+1" International Industry and Standards Organizations and the Centre for International Industrial and Technical Cooperation of the Ministry of Industry and Information Technology (MIIT). It is scheduled to grandly open on October 22 in Hall 9 of the Shenzhen Convention and Exhibition Center (Futian).Connecting technological innovation with people's livelihoods, consumer electronics represents the most active domain for the transformation of information technology. Currently, the global consumer electronics industry is entering a new era of profound transformation. Deepening efforts in underlying root technologies, formulating industry standards, and driving the leap from "Made in China" to "Created in China" and ultimately to "International Standards" constitute the essential path for industrial upgrading. CEIC 2026 will upgrade into the flagship innovation exhibition and industrial portal for consumer electronics in the Asia-Pacific region.This year's conference forums have been comprehensively upgraded. The Main Forum will invite academicians from home and abroad, leaders of international authoritative organizations such as IEC, ITU, and ETSI, as well as senior executives from top-tier enterprises, to focus on cutting-edge industry trends. The Hetao "6+1" Standards Industry Alliance will release international progress and core achievements, while hosting more than 20 parallel forums on cutting-edge technology.Relying on an exhibition space of 20,000 square meters, the congress has confirmed participation from over 300 leading technology enterprises and emerging tech-innovation brands. These cover benchmark players in various sectors—including China Media Group (CMG), China Mobile, Huawei, Honor, Lenovo, Haier, Midea, HiSilicon, NIO, XPeng, GAC Group, Dassault Systèmes, Cambridge Industries Group (CIG), EHang, Zero-G Aircraft, Beijing Embodied Intelligence, Qiyuan, AgiBot, Fourier Intelligence, Shengyan Zhixin, Huakun Zhenyu, xFusion, and Shenzhen OpenHarmony—as well as vibrant AI consumer hardware startup communities like Chase Light Group and Pojie Workshop.The event will also feature a specialized "Innovation PARK" exhibition area, host signature activities such as the Vivid Immersive Park and the National Finals of the 3rd "SparkLink OpenHarmony Cup" Application Challenge, and collaborate with Shenzhen Satellite TV to build the "Open Stage."At the press conference, organizers and guests previews the core highlights of the congress across three dimensions, centered around the event theme:Infinite Innovation Momentum: Concentrated Debut of World-First and Industry-Pioneering Benchmark Achievements Yang Tao, Deputy Director of the CEIC Organizing Committee, introduced that this edition will feature the concentrated release of a batch of world-first, national-first, and industry-pioneering benchmark outcomes.For example, in the audiovisual and imaging domain, the World Ultra HD Video Industry Alliance (UWA) will release the world's first spatial imaging standard, alongside the concentrated deployment of multiple achievements. In the AI computing domain, CMG Big Model 3.0 will be upgraded, Global Computing Power Top 10 Trends 2027 will make its debut, and the Supernode Definition and Practice White Paper will be upgraded and released. In the chip domain, five mainstream chip manufacturers will collectively launch SparkLink 2.0 chips, and the Beijing Chip IP OpenLab will be officially awarded. In the next-generation network domain, the Network 2030 Research Report will be officially published.Zeng Guosong, Secretary-General of the International SparkLink Alliance, stated that with the rapid growth of AI agents and embodied intelligent devices, the innovation of underlying wireless connection technologies has become an inevitable requirement for the intelligent upgrading of consumer electronics. During the congress, the Alliance will host the 2026 SparkLink Industry Summit & SparkLink Ecosystem Innovation Exhibition, unveiling for the first time SparkLink 3.0's core technical layout for the AI era; launching for the first time the SparkLink Connectivity Kit for intelligent agents and embodied intelligent devices to achieve low-latency, integrated communication-positioning-sensing smart connectivity; and presenting for the first time the comprehensive outcomes of cross-ecosystem fusion between SparkLink and OpenHarmony.Infinite Innovation Boundaries: Six International Alliances Anchored, Global Ecosystem Co-Building Accelerated With the Hetao "6+1" International Industry and Standards Organizations as its hub, CEIC links over 3,000 global member enterprises, seamlessly connecting the full digital foundation spanning chips, operating systems, computing power, communications, IoT, and smart terminals, creating a three-in-one closed-loop ecosystem for developers, industrial support, and global buyers.Focusing on the formulation of international industrial rules, the deployment of industry standards, and the co-building of global ecosystems, this year's congress demonstrates China's voice and leadership in the global consumer electronics domain through standards.Hu Caiyong, Secretary-General of the Global Intelligent Internet of Things Consortium (GIIC), introduced that GIIC is deeply involved in the planning of the congress and will lead three thematic forums and set up three specialized exhibition areas. Multiple representative enterprises will showcase their latest achievements, presenting a real-world experience of the Intelligent Internet of Everything.As an enterprise member representative of the alliance, Chen Rong, General Manager of Shengyan Zhixin, stated that the research, development, and industrialization of root technologies for short-range connectivity cannot be accomplished by a single enterprise alone; it requires full-chain synergy from standard refinement to mass production. After joining the alliance, the enterprise participated in standard discussions in advance and quickly matched with chip manufacturers to complete joint debugging and verification of low-latency acoustic sensing solutions, significantly compressing the product deployment cycle. He believes the alliance is becoming an industry accelerator, and Shengyan Zhixin will continue to collaborate with industry chain partners to reinforce weak links, expand application scenarios, strengthen root technologies, and enrich the industrial ecosystem.Infinite Innovation Possibilities: Future Smart Mobility and All-Scenario Smart Life Open New Frontiers CEIC 2026 lists future smart mobility as a key track for the first time, gathering benchmark enterprises such as EHang Intelligent, Zero-G Aircraft Industry, and Huawei Qiankun, covering eVTOL low-altitude aircraft, high-end intelligent cockpits, and all-scenario Connected Vehicle solutions, showcasing the cross-boundary fusion of consumer electronics technology into low-altitude mobility and smart vehicles. Simultaneously, it brings together institutions such as China Mobile Smart Home and Malanshan Audio & Video Lab, leveraging Audio & Video Vivid technology to bring multi-scenario immersive audiovisual innovation, driving cutting-edge technologies from standards R&D to commercial application closed loops.Li Nijun, Chief Marketing Officer of Zero-G Aircraft Industry, pointed out that although they have not yet joined the alliance membership system, they have already directly experienced CEIC's open posture. "We come with three expectations: understanding standards so our products iterate on the right track; connecting with the ecosystem to meet like-minded partners upstream and downstream in the industry chain; and showcasing and collaborating to present Zero-G's accumulation across dual technical routes, finding partners to solidly build the low-altitude economy together."Sun Huaqing, Deputy Director of the Centre for International Industrial and Technical Cooperation of MIIT, stated that currently, driven by new-generation information technologies such as artificial intelligence, China's consumer electronics industry has shifted from a capacity- and price-driven paradigm to an innovation-driven one. Characterized by root technology driving, standards leading, and ecosystem synergy, CEIC is dedicated to becoming a "digger at the source of innovation," propelling locally led international standards to go global. The year 2026 marks the beginning of the 15th Five-Year Plan. The 2nd CEIC will adhere to the directions of intelligence, greening, and integration, focusing on the three keywords of "Root Technology, Innovation, and Standards," fully presenting new trends in consumer electronics development across all scenarios.In this golden October, CEIC 2026 cordially invites global innovators and consumers to gather in Shenzhen to jointly explore innovative technologies, experience innovative products, and define new trends in consumer electronics together!CEIC 2026: Trends in InnovationAbout CEICThe Consumer Electronics Innovation Congress (CEIC) is a root-technology industry event rooted in China and serving the world. Driven by its core mission to "Jointly Define New Trends in Consumer Electronics," CEIC covers domains spanning root technologies, core components, smart terminals, all-scenario applications, and industrial ecosystems. It builds a one-stop platform for technology releases, product showcases, industrial seminars, investment and financing matchmaking, and international cooperation, continuously driving the AI intelligent transformation and global collaborative development of the consumer electronics industry. Sayece (Shenzhen) Technology Service Co., Ltd. serves as the operating entity for CEIC. The Consumer Electronics Innovation Congress 2026 is scheduled to be held from October 22 to 24 at the Shenzhen Convention and Exhibition Center (Futian). Industry colleagues are cordially invited to participate actively.Conference Details Link: https://www.ceic.netPress and hold the QR code to register for exhibitionScan the QR code to visit the official website

CEIC 2026 OPEN STAGE | The Stage Is Set: Bringing Outstanding Products into the Spotlight

CEIC 2026: Trends in InnovationAbout CEICThe Consumer Electronics Innovation Congress (CEIC) is a root-technology industry event rooted in China and serving the world. Driven by its core mission to "Jointly Define New Trends in Consumer Electronics," CEIC covers domains spanning root technologies, core components, smart terminals, all-scenario applications, and industrial ecosystems. It builds a one-stop platform for technology releases, product showcases, industrial seminars, investment and financing matchmaking, and international cooperation, continuously driving the AI intelligent transformation and global collaborative development of the consumer electronics industry. Sayece (Shenzhen) Technology Service Co., Ltd. serves as the operating entity for CEIC. The Consumer Electronics Innovation Congress 2026 is scheduled to be held from October 22 to 24 at the Shenzhen Convention and Exhibition Center (Futian). Industry colleagues are cordially invited to participate actively.Conference Details Link: https://www.ceic.netPress and hold the QR code to register for exhibition

[Exhibition Invitation] We invite you to explore network innovation: NIDA is waiting for you at CEIC 2025!

An event about "New Electronic · New Experience · New Consumption" is about to kick off! As a member of the organizing committee of this conference, Network Innovation and Development Alliance (NIDA) sincerely invites you to visit this conference exhibition and the NIDA booth to witness how network innovation can enable the digital intelligent society.Exhibition Information· Conference Name: Consumer Electronics Innovation Conference CEIC 2025· Exhibition Dates: November 6-8, 2025· Location: Shenzhen Convention and Exhibition Center (No. 111, Fuhua 3rd Road, Futian District, Shenzhen)· NIDA Booth: Hall 2 2C21Highlights of the NIDA booth: Network Innovation Enables Digital Intelligence SocietyNIDA, a global fixed network innovation alliance, is committed to empowering the digital intelligent society with network innovation. At our booth, you'll be able to experience cutting-edge technologies and applications around three key scenarios:New · Network Facilities: Learn about the country's major scientific and technological infrastructure in the communications field and explore the cornerstones of future networks.New intelligence in · networks: Experience cutting-edge intelligent technologies such as L4 autonomous driving networks for the AI era.New applications of the · network: Explore a new chapter in digital life with a wide variety of innovative applications.Interactive welfare activities that are not to be missed!To thank you for your interest and support, we've prepared a fun interactive activity:Activity 1: Scan the QR code and pay attention to the courtesy.· Scan the code and follow the official NIDA official account to get a customized refrigerator sticker.Activity 2: Forwarding for exclusive customization· retweet and create your exclusive vintage newspaper cover photo on-site!We look forward to seeing you,Explore the possibilities of online innovation with us!Scan the code now and make an appointment!Looking forward to meeting you at CEIC 2025!

NIDA's 2nd General Meeting Held in Shenzhen | Concentrated and Draw a New Chapter

[Shenzhen, China, November 7, 2025] At 14:00, the second general meeting of Network Innovation and Development Alliance (NIDA) was successfully held in the Tulip Hall of the Shenzhen Convention and Exhibition Center. The conference was conducted online and offline, bringing together more than 30 delegates from all over the world to review their achievements, look forward to the future, and successfully complete the agenda in an atmosphere of unity and forge ahead.The conference agenda includes three main agendas: election of the governing body, recognition of individual and group contributions in 2025, and report on the work of the council, with fruitful results: 1. China Institute of Electronic Technology Standardization and China Mobile Communications Group Co., Ltd. are elected as members of NIDA. II. The team and individuals who have made outstanding contributions to the Alliance in 2025 were honored. 3. Align the work reports of the Board of Directors, concentrate efforts, and reach consensus.At the beginning of the conference, NIDA Vice Chairman Tan Hang delivered a speech. Tan Hang said: In just over one year since NIDA was established, with the support and joint efforts of all members, great progress has been made. The new Internet has moved from concept to practice, and has been deeply involved in industry scenarios. The medical industry committee has been established to create value from innovation. We have built a new Internet standards system, established a complete framework covering both horizontal and vertical standards, and published more than 10 standards. Through organizations such as BRICS and SCO, we are spreading our best practices and accumulated standards to overseas countries. The global influence and internationalization have increased rapidly. The number of members has increased by more than 60 to 93, covering 15 countries and regions worldwide. The Alliance has established cooperative relationships with internationally renowned organizations such as the IETF, ITU, IPv6 Forum, TMF, WBBA, APAN, and BBF. This meeting is a critical moment for us to review our journey and draw a blueprint together. We look forward to hearing your insights and discussing the future of NIDA.Subsequently, the election of the governing body of the General Assembly. After strict and standardized election procedures, China Institute of Electronic Technology Standardization and China Mobile Communications Group Co., Ltd. were successfully elected as the new NIDA board members by virtue of their outstanding contributions and influence in the industry. Their entry will further strengthen the alliance in standards development and production chain synergy.In the annual member recognition phase, this recognition activity set a total of seven awards, including the Alliance Outstanding Contribution Team, Standards Editorial Contribution, Standards Project Manager, Innovation Research, Brand Contribution, Member Development, and Standards New Field. After proactive recommendation and strict review, a total of five outstanding teams and 16 outstanding individuals stood out. To receive this recognition and honor from the league. Union Vice President Tan Hang and Shi Weiqiang on the spot for the award-winning representatives awarded certificates. Their achievements vividly illustrate the spirit of forging ahead and collaborative innovation among NIDA members.Entrusted by the Council, Deng Yiou, Secretary-General of NIDA, delivered an annual report to all members on behalf of the Council. The report systematically summarizes the deliberations, decisions and priorities of the Board of Governors over the past year, and is clearly presented in the form of a list for the first time. Secretary-General Deng also introduced the substantial progress made by the Alliance in terms of organizational structure optimization, international exchanges and cooperation, and standard system building. He also disclosed the blueprint for the 2026 work plan for the first time, pointing out the direction for the next phase of collaborative innovation.The Assembly came to an end in a high spirit. This conference is not only an important point in the development of NIDA, but also an industry event that gathers consensus and stimulates momentum. In the future, NIDA will continue to join hands with all members, taking standards as the lead, taking innovation as the engine, jointly marching towards a new stage of higher quality development!

NIDA Joins Hands with Members at China Internet Conference 2025

From July 23 to 25, 2025, Network Innovation and Development Alliance (NIDA) with several member organizations was unveiled at the 24th China Internet Conference in Beijing. With the theme of "Digital-Driven New · Intelligent Future", the conference focused on cutting-edge technologies such as artificial intelligence (AI), 5G-A/6G, and low-altitude economy, and gathered global government, industry, education, and research forces to explore AI-driven industry upgrade paths and digital ecosystem reconstruction.At this conference, the theme of NIDA is "Network Evolution Drives Industry Upgrade and Network Construction Standards Promote Innovation and Implementation." Together with Beijing Xinertai Technology Co., Ltd., Nanjing Saining Information Technology Co., Ltd., Zhuhai Nebula Zhilian Technology Co., Ltd., Changsha Institute of Computing and Digital Economy, Peking University, Shenzhen Huaer Data Technology Co., Ltd., Sichuan Haiji Technology Co., Ltd. Presents the latest achievements and innovative practices of next-generation network technologies. Beijing Xinertai Technology Co., Ltd. demonstrated high-precision Ethernet test and network impairment instrument; Nanjing Saining Information Technology Co., Ltd. brought cyber security digital twin shooting range and CP-BAS security verification system to demonstrate full topology simulation and AI agent technologies. Zhuhai Nebula Zhilian Technology Co., Ltd. demonstrated its self-developed high-performance chip NIC, supporting full line-speed forwarding. Changsha Institute of Computing and Digital Economy, Peking University, launched an integrated super-intelligent computing platform to achieve multi-center computing collaboration. Shenzhen Huaer Data Technology Co., Ltd. presents the network coding distributed storage solution, which significantly improves storage efficiency. Sichuan Haiji Technology Co., Ltd. demonstrated its self-developed HiDTTM digital twin platform, which focuses on 3D modeling, simulation, and IoT technologies to provide visualization solutions for smart campuses and digital factories.Industry communication and cooperationAt the exhibition, members and NIDA communicated with many leading enterprises in the industry, discussed joining the alliance, jointly promoting the evolution of the next generation network and network construction standards, and discussed the future development direction of the next generation Internet, and promoted the implementation of innovation achievements.
Contact Us
Phone: 176-6539-7280
Email: contact@nida-alliance.org
Address: Block B, Shenzhen Hong Kong International Science Park, Futian Free Trade Zone, Futian District, Shenzhen City, Guangdong Province